Multi-chip module with a high-rate interface
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United States of America Patent
Stats
-
Dec 12, 2017
Grant Date -
May 21, 2015
app pub date -
Jan 16, 2015
filing date -
Oct 9, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multi-chip module (MCM) may include a substrate, and first and second physical-layer (PHY) chips mounted on the substrate. In some implementations, the first PHY chip includes a multiplexer and a PHY circuit. The multiplexer is configured to receive a multiplexed data stream from a media access control (MAC) device, to demultiplex the multiplexed data stream into first and second data streams, to output the first data stream to the PHY circuit, and to output the second data stream to the second PHY chip. In some implementations, the first PHY includes a router and a PHY circuit. The router is configured to receive a plurality of data packets from a MAC device, to route one or more of the data packets having a first address to the PHY circuit, and to route one or more of the data packets having a second address to the second PHY chip.
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Cited Art Landscape
Patent Citation Ranking
- 10 Citation Count
- H04L Class
- 11.47 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jun 12, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 12, 2029 |
