On board transceiver
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United States of America Patent
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Dec 12, 2017
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N/A
app pub date -
May 29, 2013
filing date -
May 29, 2013
priority date (Note) -
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Abstract
An electrical component assembly includes a substrate and first and second electrical components attached to the substrate and operably connected with each other via the substrate. In use the first electrical component generates a first amount of heat and the second component generates a second amount of heat. The first component is thermally connected with a heat sink along a first heat path and the second component is connected with the heat sink along a second, different, heat path, such that the thermal conductivity between the first and second components is lower than the thermal conductivity of the first heat path and of the second heat path.
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