Solder sealing in high-power laser devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9843164
SERIAL NO

15006733

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Abstract

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In various embodiments, laser apparatuses include thermal bonding layers between various components and sealing materials for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.

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Patent Owner(s)

Patent OwnerAddress
WBC PHOTONICS INC30 UPTON DRIVE SUITE 4 WILMINGTON MA 01887

International Classification(s)

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  • 2016 Application Filing Year
  • H01S Class
  • 1245 Applications Filed
  • 1023 Patents Issued To-Date
  • 82.17 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Deutsch, Michael Derry, US 31 287
Tayebati, Parviz Sherborn, US 181 3284

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Patent Citation Ranking

  • 2 Citation Count
  • H01S Class
  • 21.26 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges31099510030116311101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 80100 +05010015020025030035040045050055060065070075080085090095010001050

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