Three-dimensional microstructures
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United States of America Patent
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Dec 12, 2017
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N/A
app pub date -
Jul 28, 2016
filing date -
Jul 2, 2010
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Abstract
An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
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