Fingerprint sensing device with heterogeneous coating structure comprising a mold
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United States of America Patent
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Dec 12, 2017
Grant Date -
Dec 8, 2016
app pub date -
Apr 26, 2016
filing date -
Jun 8, 2015
priority date (Note) -
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Abstract
The invention relates to a fingerprint sensing device comprising a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements, the coating material comprising a plurality of cavities filled with a mold material; wherein locations of the cavities correspond to locations of the sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and wherein a dielectric constant of the mold material is higher than a dielectric constant of the coating material. The invention also relates to a method for manufacturing such a device.
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