Process for curing thermoset resins
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United States of America Patent
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Dec 12, 2017
Grant Date -
Aug 13, 2015
app pub date -
Aug 14, 2013
filing date -
Aug 17, 2012
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Abstract
Process for curing a thermoset resin comprising the step of contacting said resin with (i) an imine of the structure C(R2)(R3)═N—R1 wherein R1 is selected from hydrogen, hydroxyl, linear or branched alkyl having 1-22 carbon atoms, cycloalkyl having 3-22 carbon atoms, aryl having 6 to 15 carbon atoms, and aralkyl having 7 to 22 carbon atoms, which alkyl, cycloalkyl, aryl, and aralkyl groups may be optionally substituted with one or more groups containing heteroatoms selected from S, O, P, and/or Si. R2 is selected from C(R6)(R5)—C(═O)—R4, —C(R6)(R5)—C(═S)—R4, and —C(R6)(R5)—C(═N)—R4, wherein R4, R5, and R6 are selected from hydrogen, linear or branched alkyl having 1-6 carbon atoms, cycloalkyl having 3-12 carbon atoms, aryl, aralkyl, alkoxy having 1-6 carbon atoms, and aryloxy. R3 is selected from linear or branched alkyl having 1-22 carbon atoms, 1 cycloalkyl having 3-22 carbon atoms, aryl having 6 to 15 carbon atoms, and aralkyl having 7 to 22 carbon atoms, and (ii) methyl isopropyl ketone peroxide.
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