Curable resin composition and optical semiconductor device
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United States of America Patent
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Dec 12, 2017
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app pub date -
Mar 18, 2016
filing date -
Mar 27, 2015
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Abstract
A curable resin composition having high transparency in the UV region, UV resistance and heat resistance. The curable resin composition includes an alkoxy oligomer represented by Formula 1 of (R1R2R3SiO1/2)w(R4R5SiO2/2)x(R6SiO3/2)y(SiO4/2)z and a curing catalyst. The curing catalyst is phosphoric acid present in an amount of 3-30 parts by weight based on 100 parts by weight of the alkoxy oligomer, or alkoxide of at least one metal selected from the group consisting of B, Al, P, Sc, Ga, Y, Zr, Nb, In, Sn, La, Gd, Dy, Yb, Hf, Ta and W, present in an amount of 0.5-20 parts by weight based on 100 parts by weight of the alkoxy oligomer. Each of R1, R2, R3, R4, R5 and R6 independently represents the same or a different organic group, w, x, y and z are 0 or positive numbers satisfying the relationship of w+x+y+z=1, and the atomic ratio of O/Si is 2.3-3.5.
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