Mold for resin injection molding

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United States of America Patent

PATENT NO 9840033
SERIAL NO

14811047

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Abstract

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A mold for resin injection molding 1 having a shaping region formed by a low-density shaped portion 22 and a high-density shaped portion 21 in which each ventilation channel 32 for gas existing between an external region and a molding portion region forms a hollow state surrounded by a peripheral wall having any one or both of the high-density shaped portion 21 and the low-density shaped portion 22, and the secondary vent 33 connecting communicatively with a region molding portion is formed only by a low-density shaped portion 22 with thickness thinner than that of the shaping region.

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Patent Owner(s)

Patent OwnerAddress
MATSUURA MACHINERY CORPORATIONFUKUI CITY FUKUI 910-8530

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Amaya, Kouichi Fukui, JP 23 41
Tanaka, Ryuzo Fukui, JP 9 30
Urushizaki, Yukinori Fukui, JP 5 14

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