Vacuum pallet reflow

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9839142
APP PUB NO 20150342061A1
SERIAL NO

14820025

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Abstract

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A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.

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Patent Owner(s)

Patent OwnerAddress
IMI USA INC14312 FRANKLIN AVENUE TUSTIN CA 92780

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lutap, William Tustin, US 2 10
Nguyen, Roger Irvine, US 2 10
Patterson, Timothy P Mission Viejo, US 6 404

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