Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
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United States of America Patent
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Dec 5, 2017
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N/A
app pub date -
Feb 4, 2016
filing date -
Feb 6, 2015
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Abstract
Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less.
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