Warpage-preventing structure of substrate

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United States of America Patent

PATENT NO 9839120
SERIAL NO

14982303

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Abstract

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The present invention relates to a warpage-preventing structure for reducing the warpage of the substrate itself, the warpage which results from the difference of the metal patterns of top and bottom surfaces, and/or the warpage which results from the difference in the thermal expansion coefficients of a metal pattern and the substrate, the warpage-preventing structure comprising at least one additional metal layer, wherein the at least one additional metal layer is disposed on at least one surface of the substrate and arranged along an edge of the substrate.

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Patent Owner(s)

Patent OwnerAddress
KCC CORPORATION344 SAPYEONG-DAERO SEOCHO-GU SEOUL 06608

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Han, Moon Su Jeonju-si, KR 1 0
Im, Na Ri Iksan-si, KR 1 0
Park, Jun Hee Jeonju-si, KR 70 387

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