Methods and systems for high bandwidth chip-to-chip communcations interface
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United States of America Patent
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Dec 5, 2017
Grant Date -
Sep 29, 2016
app pub date -
Jun 7, 2016
filing date -
May 20, 2010
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Abstract
Systems and methods are described for transmitting data over physical channels to provide a high bandwidth, low latency interface between integrated circuit chips with low power utilization. Communication is performed using group signaling over multiple wires using a vector signaling code, where each wire carries a low-swing signal that may take on more than two signal values.
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