Substrate-less package structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 5, 2017
Grant Date -
N/A
app pub date -
Mar 16, 2017
filing date -
Mar 16, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
A package includes a chip, a wire, a mold layer and a redistribution layer. The chip includes a conductive pad. The wire is bonded to the conductive pad of the chip. The mold layer surrounds the first chip and the wire. The redistribution layer is disposed on the mold layer and contacts an exposed portion of the wire.
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