Structure and method of reinforcing a conductor soldering point of semiconductor device
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United States of America Patent
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Dec 5, 2017
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N/A
app pub date -
Nov 7, 2014
filing date -
Jun 30, 2014
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Abstract
The present invention provides a structure and a method of reinforcing a conductor soldering point of a semiconductor device. The structure includes an inner frame lead, a soldering area arranged on the surface of the inner frame lead, a conductor soldered in the soldering area, and a locking card including a pressing part, a locking part overhangs outwards from the pressing part pressed on the conductor. The locking part penetrates through the inner frame lead and is clamped on the side of the inner frame lead deviating from the conductor. According to the present invention, the conductor soldered on the inner frame lead is firmly clamped on the inner frame lead through the locking card to effectively avoid the stripping condition of the conductor and the inner frame lead, reinforce the electrical connection of the conductor and the inner frame lead, and improve the reliability of the semiconductor device.
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