Circuit board and method for making the same
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United States of America Patent
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Nov 28, 2017
Grant Date -
Nov 23, 2017
app pub date -
Jun 24, 2016
filing date -
May 20, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacture of a circuit board without annular through-hole rings and thus allowing a higher component density includes a base layer, a first wire pattern layer, and a second wire pattern layer on both sides of the base layer. A portion of the base layer not covered by the first wire pattern layer defines at least one first hole. The circuit board further includes a wire layer. The wire layer includes at least a first portion and a second portion connecting to the first portion. The first portion is filled in the first hole. The second portion is formed on the first portion extending away from the base layer. A diameter of the second portion is less than an aperture diameter of the first hole. The wire layer is electrically conductive between the first wire pattern layer and the second wire pattern layer through the first portion.
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