Encapsulated semiconductor device and encapsulation method

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United States of America Patent

PATENT NO 9831467
APP PUB NO 20160343988A1
SERIAL NO

15112104

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Abstract

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The present invention relates to an encapsulated semiconductor device (20) provided on a flexible substrate (1), a method of providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1) and a software product for providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1). In a preferred embodiment, an encapsulation method is presented in which the organic layer (3) of an inorganic/organic/inorganic multilayer barrier (5) on a plastic foil (1) as a substrate is removed at the edges of an OLED (13). The edges are subsequently sealed with a standard TFE process to encapsulate the OLED (13). This enables cuttable OLEDs (20) that are cut out of a larger plastic substrate (1) and gives a method to reduce side leakage in OLEDs (20) that have been manufactured in a roll-to-toll process.

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Patent Owner(s)

Patent OwnerAddress
KONINKLIJKE PHILIPS N VHOLLAND IAN DEHO FINN EINDHOVEN NORTH BRABANT

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bouten, Petrus Cornelis-Paulus Eindhoven, NL 1 8
Gierth, Rainald Manfred Köln, DE 6 14
Grabowski, Stefan Peter Neuss, DE 15 161
Hartmann, Soren Baesweiler, DE 3 12
Lifka, Herbert Eindhoven, NL 83 844
Meyer, Jens Cologne, DE 28 182
Ruske, Manfred Stephan Kerpen, DE 4 33
Van, De Weijer Peter Heeze, NL 25 301
Van, Elsbergen Volker Lambert Aachen, DE 3 17

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