Electrical interconnects for photodiode arrays and readout interface circuits in focal plane array assemblies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 28, 2017
Issued Date -
N/A
app pub date -
May 1, 2015
filing date -
May 1, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A focal plane array assembly includes a readout integrated circuit with a contact array surface, a photodiode array with a contact array surface facing the readout integrated circuit contact array surface, and an anisotropic conductive film disposed between contact array surfaces. The anisotropic conductive film includes conductive bodies that interconnect the photodiode array with the readout integrated circuit and an adhesive that couples the photodiode array to the readout integrated circuit.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully