Chip packaging module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Nov 28, 2017
Issued Date -
N/A
app pub date -
Dec 7, 2016
filing date -
Aug 20, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present disclosure discloses a chip packaging module, including: a first chip, where a first pad is disposed on a side neighboring to a front surface of the first chip; at least a second chip, where at least one second chip is disposed on a rear side of the first chip, each second chip has a second pad, and wherein the first pad of the first chip is connected to the second pad of the second chip via a redistribution layer. According to the chip packaging module in the present disclosure, a second chip is disposed on a rear side of a first chip, and a first pad is connected to a second pad via a redistribution layer. By means of a redistribution technology on surfaces of multiple chips, a lead of a pad on a front surface of a fingerprint recognition chip is masterly winded to the back for interconnection, so that an induction area on the front surface of the chip can fully contact with a human body. In addition, the multi-chip redistribution technology can also greatly narrow down an interconnection distance between chips, which improves efficiency of communication between chips.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
CN | B | CN104332452 | Aug 20, 2014 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
GRANTED PATENT FOR INVENTION | Chip packaging module | Apr 19, 2017 | |||
WO | A1 | WO2016026199 | Oct 10, 2014 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
INTERNATIONAL APPLICATION PUBLISHED WITH INTERNATIONAL SEARCH REPORT | 芯片封装模组 | Feb 25, 2016 | |||
EP | A1 | EP3113222 | Oct 10, 2014 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
APPLICATION PUBLISHED WITH SEARCH REPORT | CHIP PACKAGING MODULE | Jan 04, 2017 | |||
KR | A | KR20170010814 | Oct 10, 2014 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
UNEXAMINED PATENT APPLICATION | 칩 패키지 모듈 | Feb 01, 2017 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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SHENZHEN GOODIX TECHNOLOGY CO LTD | FLOOR 13 PHASE B TENGFEI INDUSTRIAL BUILDING FUTIAN FREE TRADE ZONE SHENZHEN 518045 |
International Classification(s)

- 2016 Application Filing Year
- H01L Class
- 27971 Applications Filed
- 23507 Patents Issued To-Date
- 84.05 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Long, Wei | Shenzhen, CN | 91 | 553 |
# of filed Patents : 91 Total Citations : 553 | |||
Wu, Baoquan | Shenzhen, CN | 16 | 47 |
# of filed Patents : 16 Total Citations : 47 |
Cited Art Landscape
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Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 8 Age
Forward Cite Landscape
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | May 28, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 28, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
May 19, 2021 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4 |
Nov 28, 2017 | I | Issuance | |
Nov 08, 2017 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Jun 01, 2017 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHENZHEN HUIDING TECHNOLOGY CO., LTD.;REEL/FRAME:042991/0618 Owner name: SHENZHEN GOODIX TECHNOLOGY CO., LTD., CHINA Effective Date: Jun 01, 2017 |
Mar 30, 2017 | P | Published | |
Dec 07, 2016 | F | Filing | |
Nov 20, 2016 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WU, BAOQUAN;LONG, WEI;REEL/FRAME:040595/0345 Owner name: SHENZHEN HUIDING TECHNOLOGY CO., LTD., CHINA Effective Date: Nov 20, 2016 |
Aug 20, 2014 | PD | Priority Date |

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