Anisotropic conductive material, electronic device including anisotropic conductive material, and method of manufacturing electronic device
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United States of America Patent
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Nov 28, 2017
Issued Date -
N/A
app pub date -
Feb 4, 2016
filing date -
Aug 31, 2015
priority date (Note) -
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Abstract
Provided are anisotropic conductive materials, electronic devices including anisotropic conductive materials, and/or methods of manufacturing the electronic devices. An anisotropic conductive material may include a plurality of particles in a matrix material layer. At least some of the particles may include a core portion and a shell portion covering the core portion. The core portion may include a conductive material that is in a liquid state at a temperature greater than 15° C. and less than or equal to about 110° C. or less. For example, the core portion may include at least one of a liquid metal, a low melting point solder, and a nanofiller. The shell portion may include an insulating material. A bonding portion formed by using the anisotropic conductive material may include the core portion outflowed from the particle and may further include an intermetallic compound.
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