Methods for forming pillar bumps on semiconductor wafers
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United States of America Patent
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Nov 28, 2017
Grant Date -
Sep 15, 2016
app pub date -
Mar 11, 2015
filing date -
Mar 11, 2015
priority date (Note) -
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Abstract
The subject matter contained herein discloses methods for forming a vertical metallic pillar overlying an under bump metal pad further overlying a semiconductor substrate, and applying a discrete solder cap on a top surface of the pillar, wherein the metallic pillar is defined by at least one photoresist layer. The method includes heating a multi-element metallic paste containing a variable amount of metallic powder, a melting point depressant and a flux such that the metal powder sinters to form the metallic pillar and simultaneously adheres the metallic pillar to the underbump metal pad.
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