Method of processing a substrate
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United States of America Patent
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Nov 28, 2017
Grant Date -
Mar 16, 2017
app pub date -
Aug 29, 2016
filing date -
Sep 10, 2015
priority date (Note) -
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Abstract
The invention relates to a method of processing a substrate, having a first surface with at least one division line formed thereon and a second surface opposite the first surface. The method comprises applying a pulsed laser beam to the substrate from the side of the first surface, at least in a plurality of positions along the at least one division line, so as to form a plurality of hole regions in the substrate, each hole region extending from the first surface towards the second surface. Each hole region is composed of a modified region and a space in the modified region open to the first surface. The method further comprises removing substrate material along the at least one division line where the plurality of hole regions has been formed.
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