Electronic device and multifunction integrated connection head assembly structure thereof
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United States of America Patent
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Nov 28, 2017
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app pub date -
May 25, 2015
filing date -
May 25, 2015
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Abstract
A multifunction integrated connection head assembly structure includes a first connection head module and a second connection head module. The first connection head module includes a first carrier body, at least two first fluid connectors, a first power connector, and a first retaining body. The second connection head module includes a second carrier body detachably connected with the first carrier body, at least two second fluid connectors respectively detachably connected with the at least two first fluid connectors, a second power connector detachably electrically connected with the first power connector, and a second retaining body detachably mated with the first retaining body. An electrical device using a multifunction integrated connection head assembly structure is further disclosed.
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