Article and process for selective etching

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United States of America Patent

PATENT NO 9828677
SERIAL NO

14596349

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Abstract

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A process for etching includes disposing an activating catalyst on a substrate; providing a vapor composition that includes an etchant oxidizer, an activatable etchant, or a combination thereof; contacting the activating catalyst with the etchant oxidizer; contacting the substrate with the activatable etchant; performing an oxidation-reduction reaction between the substrate, the activatable etchant, and the etchant oxidizer in a presence of the activating catalyst and the vapor composition; forming an etchant product that includes a plurality of atoms from the substrate; and removing the etchant product from the substrate to etch the substrate.

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Patent Owner(s)

Patent OwnerAddress
GOVERNMENT OF THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF COMMERCE THE NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY100 BUREAU DRIVE MS 2200 GAITHERSBURG MD 20899-2200

International Classification(s)

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  • 2015 Application Filing Year
  • C23C Class
  • 3009 Applications Filed
  • 2118 Patents Issued To-Date
  • 70.39 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201520162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hildreth, Owen Pacific Grove, US 11 124

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  • 1 Citation Count
  • C23C Class
  • 27.20 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges4219241045322915232201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0501001502002503003504004505005506006507007508008509009501000

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