Thermal interface materials with low secant modulus of elasticity and high thermal conductivity

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United States of America Patent

PATENT NO 9828539
SERIAL NO

15184865

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Abstract

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Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.

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Patent Owner(s)

Patent OwnerAddress
LAIRD TECHNOLOGIES INC3481 RIDER TRAIL SOUTH EARTH CITY MO 63045

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bruzda, Karen Cleveland, US 10 107
Cancar, Kathryn Lakewood, US 3 14

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