Thermally conductive filler and thermally conductive resin composition containing same
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United States of America Patent
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Nov 28, 2017
Issued Date -
N/A
app pub date -
Sep 10, 2014
filing date -
Sep 17, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A thermally conductive resin filler including a sintered body containing at least magnesium oxide, calcium oxide, and silicon oxide, the thermally conductive filler being characterized in that, when the molar number of calcium element contained in the total composition of the sintered body in terms of calcium oxide (CaO) is defined as MCa, and the molar number of silicon element contained in the total composition of the sintered body in terms of silicon oxide (SiO2) is defined as MSi, the molar ratio of the calcium oxide (CaO) to the silicon oxide (SiO2) represented by MCa/MSi is in the range of 0.1 or more and less than 2.0.
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- 1 Citation Count
- C09K Class
- 24.18 % this patent is cited more than
- 8 Age
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