Polyamide resin composition and molded article
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 28, 2017
Grant Date -
Jun 23, 2016
app pub date -
Dec 17, 2015
filing date -
Dec 18, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A polyamide resin composition comprising a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one phosphorus compound (D) selected from the group consisting of tris(2,4-di-t-butylphenyl)phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, 2,2′,2″-nitrilo(triethyl-tris(3,3′,5,5′-tetra-t-butyl-1,1′-biphenyl-2,2′-diyl))phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4′-biphenylene diphosphonite, tetrakis(2,4-di-t-butylphenyl)-4,3′-biphenylene diphosphonite, and tetrakis(2,4-di-t-butylphenyl)-3,3′-biphenylene diphosphonate, in an amount of 0.01 to 10% by mass with respect to 100% by mass of the polyamide resin composition, at least one fatty acid compound (E), and an inorganic filler (F).
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully