Particle production apparatus, particle production method and method for producing semiconductor encapsulating resin composition
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United States of America Patent
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Nov 28, 2017
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N/A
app pub date -
Feb 23, 2011
filing date -
Mar 25, 2010
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Abstract
A particle production apparatus 1 includes a processing section 3 in which a processing liquid is allowed to adhere to a surface of each of inorganic particles contained in a powder material, a chamber 4 connected to the processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the powder material, a powder material supply device 50 having a supply portion 5 and a supply unit 6 for supplying the powder material and the like into the processing section 3, and a processing liquid spraying device 70 having a nozzle 7, a pump 8, a supply unit 9 for supplying the processing liquid, a high-pressure gas (air) generating unit 11 and the like. The processing liquid spraying device 70 is configured to spray the processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3. Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.
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