Methods of transferring device wafers or layers between carrier substrates and other surfaces
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United States of America Patent
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Nov 28, 2017
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N/A
app pub date -
Jul 9, 2012
filing date -
Jul 7, 2011
priority date (Note) -
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Abstract
New temporary bonding methods and articles formed from those methods are provided. In one embodiment, the methods comprise coating a device or other ultrathin layer on a growth substrate with a rigid support layer and then bonding that stack to a carrier substrate. The growth substrate can then be removed and the ultrathin layer mounted on a final support. In another embodiment, the invention provides methods of handling device layers during processing that must occur on both sides of the fragile layer without damaging it. This is accomplished via the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.
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