Fabricating a conductive trace structure and substrate having the structure
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United States of America Patent
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Nov 21, 2017
Grant Date -
Dec 25, 2014
app pub date -
Nov 27, 2012
filing date -
Nov 28, 2011
priority date (Note) -
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Abstract
A method for fabricating a conductive trace structure includes the steps: forming a first metal layer on a non-conductive substrate; removing a part of the first metal layer to expose the non-conductive substrate so as to form the first metal layer into a plating region and a non-plating region, the plating region being divided into at least two trace-forming portions and at least one bridge portion; forming a second metal layer on the plating region by electroplating the plating region using one of the trace-forming portions and the bridge portion as an electrode; and removing the bridge portion and the second metal layer formed on the bridge portion.
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