Substrate structure and the process manufacturing the same
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United States of America Patent
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Nov 21, 2017
Grant Date -
Jul 28, 2016
app pub date -
Apr 6, 2016
filing date -
Feb 7, 2013
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Abstract
A multi-layer substrate structure to achieve multiple arrangements of power/ground domains is disclosed. The multi-layer substrate structure comprises a first layer for disposing an integrated circuit thereon and a second layer coupled to the first layer, wherein a connection structure is electrically connected to a plurality of power/ground domains on the second layer. With different combinations of the sawing lines and keep-out regions on the multi-layer substrate structure for cutting off some portions of the connection structure, the invention can achieve multiple arrangements of power/ground domains without impacting the customer's PCB or system board design so as to cut short the cycle time for engineering development phase.
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