Semiconductor assembly and method to form the same
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United States of America Patent
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Nov 21, 2017
Issued Date -
N/A
app pub date -
Mar 30, 2016
filing date -
Apr 1, 2015
priority date (Note) -
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Abstract
A semiconductor device having a composite pad including a primary portion and a subsidiary portion is disclosed. The primary portion is provided for electrical connection to an internal circuit of the semiconductor device. The subsidiary portion is provided for probing, in particular, for testing high frequency performance of the semiconductor device by probing with a RF-probe. Because the subsidiary portion is independent from the primary portion, the subsidiary portion does not affect the electrical performance of the semiconductor device. Also, the subsidiary portion has a narrowed contact area with respect to the RF-probe to lessen adherence of metal flakes from the pad onto the probe.
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