Semiconductor packages having an electric device with a recess
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 21, 2017
Issued Date -
N/A
app pub date -
Mar 29, 2013
filing date -
Mar 29, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material, thus increasing adhesion between the electric device and a substrate of the package while at the same time allowing for lower adhesive fillets.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully