Charged particle beam exposure apparatus and method of manufacturing semiconductor device
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United States of America Patent
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Nov 21, 2017
Grant Date -
Aug 27, 2015
app pub date -
Sep 30, 2014
filing date -
Feb 26, 2014
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Abstract
The invention relates to a charged particle beam exposure apparatus configured to expose cut patterns or via patterns on a substrate having a plurality of line patterns 81a arranged on an upper surface of the substrate at a constant pitch by irradiating the substrate with a plurality of charged particle beams B1 to Bn while moving a one-dimensional array beam A1 in an X direction parallel to the line patterns 81a, the one-dimensional array beam A1 being a beam in which the charged particle beams B1 to Bn are arranged in an Y direction orthogonal to the line patterns 81a.
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