Automated application of cut thermal adhesive films
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 21, 2017
Issued Date -
N/A
app pub date -
Mar 27, 2015
filing date -
Mar 28, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A system and method for causing a specialized device to cut and weed a cut thermal transfer film is provided. In an embodiment, a service provider computer receives a request for one or more designs to be attached to a substrate. The service provider computer uses the design to generate additional instructions for a thermal transfer film cutting device that describe regions of the thermal transfer film to be cut to create the one or more designs, regions of the thermal transfer film to be cut to provide a registration means, and regions of the thermal transfer film to be attached to a receiving sheet. The service provider computer sends the additional instructions to the thermal transfer film cutting device which executes the instructions on a thermal transfer film.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2015 Application Filing Year
- B26D Class
- 414 Applications Filed
- 295 Patents Issued To-Date
- 71.26 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B26D Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
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