Adhesive film and method for manufacturing semiconductor device
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United States of America Patent
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Nov 21, 2017
Grant Date -
Jul 21, 2016
app pub date -
Aug 21, 2014
filing date -
Aug 29, 2013
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Abstract
An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150° C. for 30 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≦2%, and (2) after heating at 200° C. for 10 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≧3%.
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