Dry film and printed wiring board
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United States of America Patent
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Nov 21, 2017
Grant Date -
Mar 3, 2016
app pub date -
Nov 6, 2015
filing date -
Jun 28, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
An object of the present invention is to provide: a dry film comprising a resin layer which has excellent detachability from a carrier film and in which cracking and powdering are inhibited; and a printed wiring board comprising a cured article obtained by curing the dry film. The dry film comprises a resin layer containing a thermosetting resin component, a filler and at least two solvents, wherein the at least two solvents both have a boiling point of 100° C. or higher and the boiling points of the at least two solvents are different by not less than 5° C.
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