Curable compositions

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United States of America Patent

PATENT NO 9822214
SERIAL NO

14907439

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Embodiments include curable compositions including an epoxy resin and a hardener component including a polymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 0.5:1 to 5:1. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.

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Patent Owner(s)

Patent OwnerAddress
BLUE CUBE IP LLC2030 DOW CENTER MIDLAND MI 48674

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cai, Yu Shanghai, CN 249 1519
Chen, Hongyu Shanghai, CN 185 1443
Gong, Frank Y Shanghai, CN 6 12
Mullins, Michael J Midland, US 122 1439
Storer, Joey W Midland, US 19 85
Wilson, Mark B Midland, US 27 224
Xiao, Tianhui Shanghai, CN 5 2
Xiong, Jiawen Shanghai, CN 10 3
Ye, Simon Shanghai, CN 15 2

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