Method for electroless plating

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United States of America Patent

PATENT NO 9822034
SERIAL NO

14116810

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Abstract

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The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.

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Patent Owner(s)

Patent OwnerAddress
ATOTECH DEUTSCHLAND GMBHERASMUSSTRASSE 20 BERLIN 10553

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beck, Birgit Berlin, DE 4 4
Brüning, Frank Berlin, DE 6 12
Dosse, Bexy Berlin, DE 2 0
Etzkorn, Johannes Bochum, DE 5 17

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