Thick cubic boron nitride (CBN) layer and manufacturing process therefor
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United States of America Patent
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Nov 21, 2017
Grant Date -
Aug 7, 2014
app pub date -
May 29, 2012
filing date -
May 27, 2011
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Abstract
A method for forming a stand-alone wafer or a coating on a substrate uses a composite of cubic boron nitride (cBN) particles and other materials, such as nitrides, carbides, carbonitrides, borides, oxides, and metallic phase materials. The wafer or coating may be formed of a thickness up to about 1000 microns for improved wear life. The density of material within the wafer or coating may be varied according to desired parameters, and a gradient of particle sizes for the cBN may be presented across the thickness of the material.
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