Laser cutting method
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United States of America Patent
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Nov 21, 2017
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app pub date -
Sep 13, 2012
filing date -
Sep 16, 2011
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Abstract
A laser cutting method and a laser cutting apparatus cut a metallic work with a laser beam of a one-micrometer waveband. The method and apparatus carry out the laser cutting of the work with a ring beam RB passed through a focus position of a condenser lens 13 and having inner and outer diameters that tend to expand. The outer diameter of the ring beam is in a range of 300 μm (micrometers) to 600 μm, an inner diameter ratio of the same is in a range of 30 % to 70 %, and a focal depth of the condenser lens is in a range of 2 mm to 5 mm.
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