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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SENJU METAL INDUSTRY CO LTD	23 SENJU-HASHIDO-CHO ADACHI-KU TOKYO 120-8555

International Classification(s)

• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Kuramoto, Takeo	Atsugi, JP	16	196
Tsuruta, Kaichi	Tochigi, JP	25	199

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	May 21, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	May 21, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
November 21, 2017	US,9821397,B2   US9821397B2	GRANTED PATENT AS SECOND PUBLICATION
November 25, 2004	US,20040236637,A1   US20040236637A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9821397

Solder precoating method and workpiece for electronic equipment

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