Package and method for fabricating package
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United States of America Patent
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Nov 14, 2017
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N/A
app pub date -
Jun 1, 2015
filing date -
Jun 4, 2014
priority date (Note) -
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Abstract
A package that hermetically seals an integrated circuit includes a metal lid (7) and a metal housing (10) having an open upper portion (12). In the package, the housing (10) includes in a wall surface thereof a glass unit (2) that seals a plurality of lead terminals therein. The glass unit (2) is disposed in a wall surface of the housing (10) such that a thickness in a vertical direction of the wall surface on an upper side of the glass unit (2) is determined according to a threshold limit value of a difference in temperature between glass that forms the glass unit (2) and metal that forms the wall surface.
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