Semiconductor device and manufacturing method of semiconductor device

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United States of America Patent

PATENT NO 9818840
SERIAL NO

15474858

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Abstract

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A semiconductor device includes a first semiconductor layer formed on a substrate; a second semiconductor layer and a third semiconductor layer formed on the first semiconductor layer; a fourth semiconductor layer formed on the third semiconductor layer; a gate electrode formed on the fourth semiconductor layer; and a source electrode and a drain electrode formed in contact with the second semiconductor layer. The third semiconductor layer and the fourth semiconductor layer are formed in an area immediately below the gate electrode, the fourth semiconductor layer is formed with a p-type semiconductor material, and the second semiconductor layer and the third semiconductor layer are formed with AlGaN, and the third semiconductor layer has a lower composition ratio of Al than that of the second semiconductor layer.

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Patent Owner(s)

  • TRANSPHORM JAPAN, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kikkawa, Toshihide Goleta, US 100 2353

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