Hybrid analog-digital pixel implemented in a stacked configuration
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United States of America Patent
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Nov 14, 2017
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Nov 12, 2015
filing date -
Nov 12, 2015
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Abstract
A hybrid analog-digital pixel circuit is fabricated on two wafers. A first wafer includes the analog pixel circuitry and a second wafer includes the digital control and processing circuitry. Externally accessible contact structures for electrically interconnecting the two wafers are arranged in groups. Each group includes externally accessible contact structures for carrying signals associated solely with operation of a corresponding pixel.
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