Conductive paste and die bonding method

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United States of America Patent

PATENT NO 9818718
SERIAL NO

14394347

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Abstract

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Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste.

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Patent Owner(s)

Patent OwnerAddress
KAKEN TECH CO LTDKATANO-SHI OSAKA 576-0036

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujita, Akira Shiga, JP 77 584
Furui, Hirohiko Shiga, JP 7 33
Hori, Shigeo Osaka, JP 19 173

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