Multi-layer polishing pad for CMP

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9818618
SERIAL NO

14700580

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a top layer, a middle layer and a bottom layer, wherein the top layer and bottom layer are joined together by the middle layer, and without the use of an adhesive. The invention is also directed to a multi-layer polishing pad comprising an optically transmissive region, wherein the layers of the multi-layer polishing pad are joined together without the use of an adhesive.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
CMC MATERIALS LLC1209 ORANGE STREET WILMINGTON DE 19801

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blake, Garrett Naperville, US 1 0
Mrzyglod, Brian Elburn, US 1 0
Nair, Jayakrishnan Naperville, US 4 33

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 May 14, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 May 14, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00