Apparatus for molecular adhesion bonding with compensation for radial misalignment
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United States of America Patent
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Nov 14, 2017
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app pub date -
Aug 7, 2015
filing date -
Jul 7, 2010
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Abstract
A method for bonding a first wafer onto a second wafer by molecular adhesion where the wafers have an initial radial misalignment between them. The method includes bringing the two wafers into contact so as to initiate the propagation of a bonding wave between the two wafers while a predefined bonding curvature is imposed on at least one of the two wafers during the contacting step as a function of the initial radial misalignment.
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