Method of depositing a resin material on a semiconductor body with an inkjet process

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United States of America Patent

PATENT NO 9818602
SERIAL NO

14861126

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Abstract

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A method a described which includes depositing a first component of a multicomponent system by means of an inkjet process, and depositing a second component of the multicomponent system by means of an inkjet process.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AUSTRIA AG2 SIEMENS STREET VILLACH AUSTRIA VILLACH CARINTHIA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Heinrici, Markus Villach, AT 12 51
Janski, Rafael Villach, AT 6 14
Kraeuter, Susanne Vienna, AT 2 1
Mischitz, Martin Wernberg, AT 23 81
Schwab, Stefan Vienna, AT 35 162

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