Substrate cleaning method and recording medium
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Nov 14, 2017
Issued Date -
N/A
app pub date -
Jul 27, 2015
filing date -
Jul 31, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An object of the present invention is to be able to obtain a high removing performance of particles. The substrate processing method according to the exemplary embodiment comprises a film-forming treatment solution supply step and a removing solution supply step. The film-forming treatment solution supply step comprising supplying to a substrate, a film-forming treatment solution containing an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent is supplied. The removing solution supply step comprises supplying to a treatment film formed by solidification or curing of the film-forming treatment solution on the substrate, a removing solution capable of removing the treatment film.
First Claim
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TOKYO ELECTRON LIMITED | MINATO-KU TOKYO 107-6325 | |
JSR CORPORATION | MINATO-KU TOKYO 105-8640 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Aibara, Meitoku | Koshi, JP | 16 | 118 |
# of filed Patents : 16 Total Citations : 118 | |||
Kanno, Itaru | Tokyo, JP | 54 | 745 |
# of filed Patents : 54 Total Citations : 745 | |||
Kawano, Hisashi | Koshi, JP | 25 | 121 |
# of filed Patents : 25 Total Citations : 121 | |||
Mochida, Kenji | Tokyo, JP | 14 | 97 |
# of filed Patents : 14 Total Citations : 97 | |||
Shima, Motoyuki | Tokyo, JP | 18 | 112 |
# of filed Patents : 18 Total Citations : 112 | |||
Yamashita, Masami | Koshi, JP | 63 | 747 |
# of filed Patents : 63 Total Citations : 747 | |||
Yoshida, Yuki | Koshi, JP | 139 | 773 |
# of filed Patents : 139 Total Citations : 773 |
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Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 18.50 % this patent is cited more than
- 8 Age
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Fee | Large entity fee | small entity fee | micro entity fee | due date |
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