Substrate cleaning method and recording medium

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United States of America Patent

PATENT NO 9818598
SERIAL NO

14809373

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An object of the present invention is to be able to obtain a high removing performance of particles. The substrate processing method according to the exemplary embodiment comprises a film-forming treatment solution supply step and a removing solution supply step. The film-forming treatment solution supply step comprising supplying to a substrate, a film-forming treatment solution containing an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent is supplied. The removing solution supply step comprises supplying to a treatment film formed by solidification or curing of the film-forming treatment solution on the substrate, a removing solution capable of removing the treatment film.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDMINATO-KU TOKYO 107-6325
JSR CORPORATIONMINATO-KU TOKYO 105-8640

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aibara, Meitoku Koshi, JP 16 118
Kanno, Itaru Tokyo, JP 54 745
Kawano, Hisashi Koshi, JP 25 121
Mochida, Kenji Tokyo, JP 14 97
Shima, Motoyuki Tokyo, JP 18 112
Yamashita, Masami Koshi, JP 63 747
Yoshida, Yuki Koshi, JP 139 773

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges26979357140748325312788503629173801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000950010000

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