Configuration and method of operation of an electrodeposition system for improved process stability and performance
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United States of America Patent
Stats
-
Nov 14, 2017
Issued Date -
N/A
app pub date -
Dec 13, 2011
filing date -
Jan 7, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Methods, systems, and apparatus for plating a metal onto a work piece with a plating solution having a low oxygen concentration are described. In one aspect, a method includes reducing an oxygen concentration of a plating solution. The plating solution includes about 100 parts per million or less of an accelerator. After reducing the oxygen concentration of the plating solution, a wafer substrate is contacted with the plating solution in a plating cell. The oxygen concentration of the plating solution in the plating cell is about 1 part per million or less. A metal is electroplated with the plating solution onto the wafer substrate in the plating cell. After electroplating the metal onto the wafer substrate, an oxidizing strength of the plating solution is increased.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2011 Application Filing Year
- C25D Class
- 430 Applications Filed
- 287 Patents Issued To-Date
- 66.75 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- C25D Class
- 36.72 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | May 14, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 14, 2029 |
